Large-Scale Systems
- Equipment up to 2.5m cutting capacity
- Multi-station automated production lines
- Integration with existing factory systems
Complete Software Development
- Custom control systems
- Process optimization algorithms
- Remote monitoring and diagnostics
Rapid Prototyping
- 3D modeling and simulation
- Quick prototype manufacturing
- Fast iteration based on your feedback
Direct Engineering Support
- One-on-one consultation with our design team
- Site visits for complex installations
- Ongoing technical partnership
Need a Custom Solution?
Oscillating Multi-wire Cutting Machine
- Max Workpiece Length (mm):380
- Max Workpiece Width (mm):160
- Max Workpiece Height (mm):150
- Swinging Cutting Technology
- Inverted Cutting Technology
Oscillating Diamond Wire Saw
- Max Workpiece Length (mm):200
- Max Workpiece Width (mm):200
- Max Workpiece Height (mm):200
- Swinging Cutting Technology
- 360° Rotation Cutting Technology
Slice + Rotate + Tilt all in One
- Max Workpiece Length (mm):200
- Max Workpiece Width (mm):200
- Max Workpiece Height (mm):150
- Rotate Cutting Technology
- Tile Cutting Technology
QUARTZ GLASS WIRE CUTTING MACHINE
- Max Workpiece Dia (mm): 600
- Max Workpiece Height (mm):400
- Rotate Cutting Technology
- Horizontal Cutting Technology
- Siemens System
3D TAPER CUT ENDLESS DIAMOND WIRE SAW MACHINE
- Max Workpiece Length (mm):600
- Max Workpiece Width (mm):600
- Max Workpiece Height (mm):600
- Vertical Cutting
- Tilt Workpiece
Swinging Diamond Wire Cutting Equipment
- Max Workpiece Length (mm):400
- Max Workpiece Width (mm):400
- Max Workpiece Height (mm):375
- Swing Cut
- Gantry Type Cut
Why Leading Companies Choose Vimfun:
🏆 Proven Industrial Expertise
- 20+ years in precision equipment manufacturing
- Pioneer in endless diamond wire technology since 2019
- Serving aerospace, semiconductor, optical, and automotive industries
- Technical Trends
- levy
We spent the first six months with our wire saw convinced that faster wire speed always meant faster cuts. Then we ran a batch of sapphire wafers at 70 m/s and watched the sub-surface damage rate triple compared to the same run at 45 m/s. The diamond wire cutting process isn’t about
- Technical Trends
- levy
Most engineers blame the diamond abrasive when a wire loop cuts poorly. We did too — until we burned through $30K in premium diamond wire on a sapphire wafer line and still had 15% yield loss from wavy cuts and micro-chipping. The problem wasn’t the diamonds. It was the diamond wire loop
- Technical Trends
- levy
In traditional diamond wire cutting processes, operators have historically relied on years of experience, intuition, and manual observation to adjust cutting parameters. However, this “black box” operational model is rapidly becoming obsolete, especially as industries machining silicon carbide (SiC), sapphire, and quartz demand stricter micron-level tolerances. Modern manufacturing requires “white