Large-Scale Systems
- Equipment up to 2.5m cutting capacity
- Multi-station automated production lines
- Integration with existing factory systems
Complete Software Development
- Custom control systems
- Process optimization algorithms
- Remote monitoring and diagnostics
Rapid Prototyping
- 3D modeling and simulation
- Quick prototype manufacturing
- Fast iteration based on your feedback
Direct Engineering Support
- One-on-one consultation with our design team
- Site visits for complex installations
- Ongoing technical partnership
Need a Custom Solution?
Oscillating Multi-wire Cutting Machine
- Max Workpiece Length (mm):380
- Max Workpiece Width (mm):160
- Max Workpiece Height (mm):150
- Swinging Cutting Technology
- Inverted Cutting Technology
Oscillating Diamond Wire Saw
- Max Workpiece Length (mm):200
- Max Workpiece Width (mm):200
- Max Workpiece Height (mm):200
- Swinging Cutting Technology
- 360° Rotation Cutting Technology
Slice + Rotate + Tilt all in One
- Max Workpiece Length (mm):200
- Max Workpiece Width (mm):200
- Max Workpiece Height (mm):150
- Rotate Cutting Technology
- Tile Cutting Technology
QUARTZ GLASS WIRE CUTTING MACHINE
- Max Workpiece Dia (mm): 600
- Max Workpiece Height (mm):400
- Rotate Cutting Technology
- Horizontal Cutting Technology
- Siemens System
3D TAPER CUT ENDLESS DIAMOND WIRE SAW MACHINE
- Max Workpiece Length (mm):600
- Max Workpiece Width (mm):600
- Max Workpiece Height (mm):600
- Vertical Cutting
- Tilt Workpiece
Swinging Diamond Wire Cutting Equipment
- Max Workpiece Length (mm):400
- Max Workpiece Width (mm):400
- Max Workpiece Height (mm):375
- Swing Cut
- Gantry Type Cut
Why Leading Companies Choose Vimfun:
🏆 Proven Industrial Expertise
- 20+ years in precision equipment manufacturing
- Pioneer in endless diamond wire technology since 2019
- Serving aerospace, semiconductor, optical, and automotive industries
- NEWS & INSIGHTS
- bianji
Do you know how large companies cut graphite, which is a hard black block? Special tools make it possible to make clean, smooth cuts. After working in the field for 7 years, I can say that the right machine makes the job much easier and safer. This article talks about
- Technical Trends
- levy
We had a cutting line producing 300μm silicon wafers with ±25μm TTV — three times the spec limit. The operator swore the wire was defective. Static bench testing showed the tension was “fine.” But under operating load at 50 m/s, dynamic tension distribution was varying by 7% around the loop.
- Customer Stories
- Daria