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SG 20
SG20 is a compact CNC Glass Cutting Wire Saw，also called glass cutting Wire Saw. It uses an enfdless diamond wire as a cutting tool. It is very suitable for laboratories and small studios to cut various glass, ceramics, gemstones and other hard materials.
This CNC Glass Cutting Wire Saw uses a gantry structure, and the cutting line cuts from top to bottom. It is very convenient to load the workpiece. It only needs to be glued to the loading table, and the cut part will not fall after the cutting line cuts through the material, so there is no need for workers to take care of it. It only needs to be processed after the equipment program is completed or the next day. The equipment of this structure also has larger models, and can also be upgraded to a special-shaped cutting program for complex contour cutting.
| Non. | Article | Content |
|---|---|---|
| 1 | Loading Worktable Size | 200*280 mm |
| 2 | Y-axis, Z-axis Travel | 250*250 mm |
| 3 | Maximum Product Size | 200*200 *200 mm |
| 4 | Worktable Load | 50 Kg |
| 5 | Maximum Lina Speed | 2100 rpm/min |
| 6 | Maximum Processing Efficiency | 1000 mm/min |
| 7 | Diamond Wire Diameter | ∮0.35～0.8 mm |
| 8 | Positioning Accuracy | ±0.01 mm |
| 9 | Processing Accuracy | ≤0.03 mm |
| 10 | Surface Roughness (Ra) | Ra ≤ 60μm |
| 11 | Diamond Wire Length | 2920 mm |
| 12 | Main Guide Wheel Diameter | ∮260 mm |
| 13 | Subsidiary Guide Wheel Diameter | ∮180 mm (4 pieces) |
| 14 | PC Monitor Size | 19 inches |
| 15 | Equipment Power | 4.5 KW |
| 16 | Operating Voltage | 220V 50Hz ±10％ |
| 17 | Ambient Temperature | 10℃～30℃ |
| 18 | Equipment Dimensions | 800*850*1920 mm |
The cutting tool used by the equipment is also the latest ring-shaped diamond wire loop. By forming the diamond wire into a closed loop, the one-way movement of the cutting wire is achieved, which greatly improves the linear speed and the smoothness of the cutting surface. It is a cutting machine with good precision .
Les boucles en fil diamanté sont de 3 types différents : Revêtement intégral, revêtement de segments et revêtement de fils. Chacun a ses avantages.
Cliquez ici pour en savoir plus sur Coupe des boucles de fil.
SG 20 CNC Glass Cutting Wire Saw
Vitrine de l'effet de coupe sur le site du client
Cliquez pour regarder d'autres vidéos montrant notre machine à découper en action.
The Difference between SG 20 diamond wire saw machine and ID Slicer
Endless Diamond Wire Cutting Equipment et Inner Diameter Slicing Machines are both used for cutting hard and brittle materials like glass and magnet. but they differ significantly in their design, operation, and applications.
Description:
- Endless Diamond Wire Cutting Equipment uses a continuous loop of diamond-coated wire to cut through materials. It is known for its high precision and ability to cut large and thick materials efficiently.
- Inner Diameter (ID) Slicing Machine uses a circular blade with an inner diameter edge coated with diamond particles. It is typically used for slicing smaller, thinner materials with high precision.
Comparison Table:
| Fonctionnalité | Endless Diamond Wire Cutting Equipment | Inner Diameter Slicing Machine |
|---|---|---|
| Mécanisme de coupe | Continuous loop of diamond-coated wire | Circular blade with diamond-coated inner diameter edge |
| Material Thickness | Suitable for thick and large materials | Best for thin and small materials |
| Cutting Precision | High precision with smooth cuts | high precision with smooth cuts |
| Déchets de matériaux | Minimal material waste due to thin wire | Minimal material waste due to thin blade |
| Vitesse de coupe | High cutting speed | Moderate to high cutting speed |
| Operational Cost | Generally lower operational costs | Higher operational costs due to blade wear and replacement |
| Maintenance | Regular wire inspection and replacement | Frequent blade maintenance and replacement |
| Applications | Photovoltaic , semiconductor, Magenet, Optics | Photovoltaic , semiconductor, Magenet, Optics |
| Initial Investment | Moderate to high | Haut |
| Flexibility | More flexible, can handle various shapes and sizes | Less flexible, best for specific size ranges |
| Surface Quality | Produces smooth surface finishes | Produces smooth surface finishes |
| Production Volume | Suitable for high-volume production | Suitable for low-volume production |
Résumé:
Endless Diamond Wire Cutting Equipment is ideal for applications requiring high efficiency and the ability to handle large, thick materials with minimal waste. It offers flexibility and lower operational costs, making it suitable for industries like optoelectronic and semiconductor manufacturing.
Inner Diameter Slicing Machines excel in precision cutting of thinner and smaller materials, producing extremely smooth surfaces. They are commonly used in semiconductor and optoelectronic industries but come with higher operational costs and maintenance requirements.
Both types of equipment have their unique advantages and are chosen based on specific cutting requirements and application needs.
Optoélectronique
Scie à fil CNC pour la découpe du verre
La fraise est utilisée pour façonner le saphir synthétique et d'autres cristaux utilisés dans les technologies LED et laser.
Optoélectronique
Scie à fil CNC pour la découpe du verre
La fraise est utilisée pour façonner le saphir synthétique et d'autres cristaux utilisés dans les technologies LED et laser.
Bijoux et produits de luxe
Scie à fil CNC pour la découpe du verre
Fabrication de pierres précieuses de grande taille et de verre saphir pour les montres et les écrans électroniques haut de gamme.
Industrie céramique
Scie à fil CNC pour la découpe du verre
Ce modèle de machine peut couper des céramiques industrielles telles que l'alumine (oxyde d'aluminium), le carbure de silicium, la zircone, la cordiérite, le titanate...
Industrie des semi-conducteurs
Scie à fil CNC pour la découpe du verre
Cette machine est utilisée pour trancher le quartz et d'autres substrats cristallins, qui sont à la base des plaquettes et des puces semi-conductrices.
Compact and Clean Design
Unmatched Cutting Efficiency
Respect de l'environnement
Superior Alternative to Inner-Circle Slicers
High Precision Cutting
Safty
Quelle est l'épaisseur maximale que la machine peut traiter pour la découpe ?
Quelle est la différence entre cette scie à fil et ID SAW ?
Leurs outils de coupe diffèrent : l'un utilise un câble diamanté et l'autre une lame, ce qui fait de l'un une méthode de coupe flexible et de l'autre une approche de coupe rigide. En outre, les trancheuses à cercle intérieur limitent la taille de la pièce à un diamètre inférieur à celui de la lame, alors que la scie à câble SHINE OptiGantry n'a pas cette restriction.
