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Multi Wire Saw
At the forefront of diamond wire cutting technology, we continuously drive innovation in the development of our circular diamond wire cutting equipment, Our production of complete machine series, such as reciprocating diamond wire cutting machines, grinding machines, and polishing machines.
DIamond Multi Wire Saw for Silicon Wafer
- Max Workpiece Length (mm): 490
- Max Workpiece Width (mm): 300
- Max Workpiece Height (mm): 300