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SG 40
SG 40 Glass Wire Cutting Machine for cutting and processing silicon, glass, sapphire, quartz, jade, and other materials using diamond wire. Through a high-speed diamond wire, this equipment achieves a processing technique for cutting workpieces. It is a new type of equipment with reliable functionality, high cutting efficiency, and high processing accuracy.
This Glass Wire Cutting Machine uses a gantry structure, and the cutting wire cuts from top to bottom. It is very convenient to load the workpiece. It only needs to be glued to the loading table, and the cut part will not fall after the cutting wire cuts through the material, so there is no need for workers to take care of it. It only needs to be processed after the equipment program is completed or the next day. The equipment of this structure also has smaller models.
| No. | Item | Content |
| 1 | Loading Worktable Size | 400*400 mm |
| 2 | Y-axis, Z-axis Travel | 400*350 mm |
| 3 | Maximum Product Size | 400*400 *350 mm |
| 4 | Worktable Load | 50 Kg |
| 5 | Maximum Lina Speed | 2100 rpm/min |
| 6 | Maximum Processing Efficiency | 1000 mm/min |
| 7 | Diamond Wire Diameter | ∮0.35～0.8 mm |
| 8 | Positioning Accuracy | ±0.01 mm |
| 9 | Processing Accuracy | ≤0.05 mm |
| 10 | Surface Roughness (Ra) | Ra ≤ 60μm |
| 11 | Diamond Wire Length | 2510 mm |
| 12 | Main Guide Wheel Diameter | ∮260 mm |
| 13 | Subsidiary Guide Wheel Diameter | ∮180 mm (4 pieces) |
| 14 | Operating Voltage | 220V 50Hz ±10％ |
| 15 | Ambient Temperature | 10℃～30℃ |
| 16 | Equipment Dimensions | 1200*950*2000 mm |
The cutting tool used by the equipment is also the latest ring-shaped diamond wire. By forming the diamond wire into a closed loop, the one-way movement of the cutting wire is achieved, which greatly improves the linear speed and the smoothness of the cutting surface. It is a cutting machine with good precision .
Diamond Wire Loop has 3 different types: Full coating ,Segment Coating and Thread Coating. Each has it’s advanagtes.
Click here to learn more about Cutting wire loops.
SG 40 Glass Wire Cutting Machine
Customer On-site Cutting Effect Showcase
Click To Watch More Videos Showing Our Cutting Machine In Action.
The Difference between SG40 Glass Wire Cutting Machine and other types
Comparison of Diamond Wire Cutting and EDM Wire Cutting
| Characteristics | Diamond Wire Cutting | EDM Wire Cutting |
|---|---|---|
| Material Compatibility | Suitable for various materials | Limited to conductive materials |
| Cutting Speed | Fast | Relatively slow |
| Material Thickness | Not limited | Limited by material thickness |
| Precision | High | High |
| Heat Generation | Low | None |
| Wire Breakage | Susceptible | Minimal |
| Operating Costs | Moderate to high | Moderate to high |
| Maintenance | Requires frequent wire replacement | Potential for electrode wear |
| Application Flexibility | Suitable for complex shapes | Suitable for complex shapes |
| Waste Material | Minimal | Minimal |
Optoelectronics
Glass Wire Cutting Machine
The cutter is employed to shape synthetic sapphire and other crystals used in LED and laser technologies.
Optoelectronics
Glass Wire Cutting Machine
The cutter is employed to shape synthetic sapphire and other crystals used in LED and laser technologies.
Jewelry and Luxury Goods
Glass Wire Cutting Machine
Crafting of large gemstones and sapphire glass for watches and high-end electronics displays.
Ceramic industry
diamond wire saw for glass
This machine model can cut industrial ceramic such as Alumina (Aluminum Oxide), Silicon Carbide, Zirconia, Cordierite, Titanate…
Semiconductor Industry
Glass Wire Cutting Machine
This machine is used for slicing quartz and other crystal substrates, which are foundational for semiconductor wafers and chips.
Compact and Clean Design
Ease of Operation
High Precision Cutting
Superior Alternative to Inner-Circle Slicers
Safty
Eco-friendly
What is the maximum thickness the machine can handle for cutting?
What is the difference between this wire saw and ID SAW?
Their cutting tools differ; one uses a diamond wire and the other a blade, making one a flexible cutting method and the other a rigid cutting approach. Furthermore, inner-circle slicers limit the workpiece size to be smaller than the blade’s inner diameter, whereas SHINE OptiGantry Wire Saw does not have this restriction.
