Large-Scale Systems
- Equipment up to 2.5m cutting capacity
- Multi-station automated production lines
- Integration with existing factory systems
Complete Software Development
- Custom control systems
- Process optimization algorithms
- Remote monitoring and diagnostics
Rapid Prototyping
- 3D modeling and simulation
- Quick prototype manufacturing
- Fast iteration based on your feedback
Direct Engineering Support
- One-on-one consultation with our design team
- Site visits for complex installations
- Ongoing technical partnership
Need a Custom Solution?
Oscillating Multi-wire Cutting Machine
- Max Workpiece Length (mm):380
- Max Workpiece Width (mm):160
- Max Workpiece Height (mm):150
- Swinging Cutting Technology
- Inverted Cutting Technology
Oscillating Diamond Wire Saw
- Max Workpiece Length (mm):200
- Max Workpiece Width (mm):200
- Max Workpiece Height (mm):200
- Swinging Cutting Technology
- 360° Rotation Cutting Technology
Slice + Rotate + Tilt all in One
- Max Workpiece Length (mm):200
- Max Workpiece Width (mm):200
- Max Workpiece Height (mm):150
- Rotate Cutting Technology
- Tile Cutting Technology
QUARTZ GLASS WIRE CUTTING MACHINE
- Max Workpiece Dia (mm): 600
- Max Workpiece Height (mm):400
- Rotate Cutting Technology
- Horizontal Cutting Technology
- Siemens System
3D TAPER CUT ENDLESS DIAMOND WIRE SAW MACHINE
- Max Workpiece Length (mm):600
- Max Workpiece Width (mm):600
- Max Workpiece Height (mm):600
- Vertical Cutting
- Tilt Workpiece
Swinging Diamond Wire Cutting Equipment
- Max Workpiece Length (mm):400
- Max Workpiece Width (mm):400
- Max Workpiece Height (mm):375
- Swing Cut
- Gantry Type Cut
Why Leading Companies Choose Vimfun:
🏆 Proven Industrial Expertise
- 20+ years in precision equipment manufacturing
- Pioneer in endless diamond wire technology since 2019
- Serving aerospace, semiconductor, optical, and automotive industries
- Customer Stories
- Daria
- Technical Trends
- levy
We spent the first six months with our wire saw convinced that faster wire speed always meant faster cuts. Then we ran a batch of sapphire wafers at 70 m/s and watched the sub-surface damage rate triple compared to the same run at 45 m/s. The diamond wire cutting process isn’t about
- Technical Trends
- levy
Most engineers blame the diamond abrasive when a wire loop cuts poorly. We did too — until we burned through $30K in premium diamond wire on a sapphire wafer line and still had 15% yield loss from wavy cuts and micro-chipping. The problem wasn’t the diamonds. It was the diamond wire loop